BH Materials Co., Ltd. · Manufacturing & Trade

Premium Materials
for Next-Generation
Semiconductor FEOL & BEOL

Providing high-purity, thermally stable, and precision-engineered material solutions across the entire semiconductor manufacturing process — from front-end fabrication to back-end packaging.

5N
Min. Purity Grade
±5μm
Dimensional Tolerance
1600°C
Thermal Stability
24/7
Global Logistics Desk

Engineered for every critical step, from FEOL to BEOL

Every material and component we supply is qualified against the three properties that matter most across the process flow: purity, thermal performance, and durability.

01 / Purity

Ultra-High Purity & Zero Contamination

Manufactured and sourced under controlled processes to minimize metallic and ionic impurities, protecting sensitive dies and devices from contamination across front-end and back-end steps.

Purity≥ 99.999% (5N)
02 / Thermal

Superior Thermal Conductivity & Stability

High thermal conductivity and closely matched coefficients of thermal expansion keep components dimensionally stable under rapid thermal cycling, reducing warpage across the line.

Conductivity120–270 W/m·K
03 / Durability

Exceptional Wear & Chemical Resistance

Near-diamond hardness and strong resistance to acids, plasma, and abrasive handling extend service life and hold tight geometry across thousands of process cycles.

Hardness~9.5 Mohs

Materials and components across the full process flow

From front-end fabrication to back-end packaging, our catalog spans standard materials and fully custom, drawing-based components.

Front-end Process · FEOL
Standard · High Purity

High-Purity Silicon & Precursor Materials

Polysilicon and precursor-grade materials for deposition, diffusion, and epitaxy processes.

Purity≥ 99.9999% (6N)
Metallic Impurity< 1 ppb
FormGranule / Chunk / Rod
PackagingCleanroom-sealed
Standard · CMP

CMP Slurries & Consumables

Chemical mechanical planarization slurries and pads tuned for oxide, metal, and STI processes.

Particle Size< 50 nm
pH Range2 – 11 (by grade)
Removal RateProcess-matched
Lot ControlCOA per batch
Standard · Lithography

Photoresist & Wet Chemicals

Photoresist and high-purity wet chemicals for lithography, etch, and wafer cleaning steps.

GradeSemiconductor / EL
Metallic Ion< 1 ppb
FiltrationDown to 0.02 μm
PackagingBottle / Drum / IBC
Back-end Process · BEOL
Standard · Wire Bonding

Bonding Wire

Au, Cu, and Ag bonding wire engineered for consistent loop control and bond reliability.

Diameter15 – 50 μm
Elongation3 – 6%
Breaking LoadSpec-matched
Spool OptionsCustom length
Standard · Encapsulation

Molding Compound

Epoxy molding compounds for chip encapsulation, matched to package type and reliability target.

CTEProcess-matched
Tg> 150 °C
Filler ContentBy grade
MSL RatingMSL1 / MSL3
Custom · Drawing-based

Precision Ceramic & Susceptor Components

SiC and fine-ceramic dummy wafers, susceptors, rings, and fixtures machined to your tool geometry.

Tolerance± 5 μm
Max. Temp.1600 °C
Surface FinishRa < 0.05 μm
Lead TimeFrom 3 weeks

Where material science meets global-scale delivery

As a company that manufactures as well as trades, we pair proprietary R&D and OEM engineering with a supply chain built for zero-surprise delivery.

In-house Material R&D

Proprietary formulation and process development let us engineer purity, thermal, and mechanical properties around your specific process window, not just an off-the-shelf spec.

Proprietary formulations

OEM / ODM Technical Development

Our engineering team works directly from your drawing or performance target to develop and qualify a custom material or component, from prototype through mass production.

Drawing-to-production support

Integrated Supply Chain & Quality Control

In-house production combined with certified partner manufacturing secures capacity, while lot-by-lot inspection and global freight networks keep delivery on schedule.

In-house + certified partners

Send us your drawing or spec

Share your material spec, application, and target volume — our engineering team will respond with a technical review and quotation, typically within 2 business days.

Email
info@bhma.co.kr
Phone
+82 10 7963 6204
HQ
101-1211, Digital Empire 2, 88 Sinwon-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
Coverage
APAC · Middle East · North America · Europe

Have a CAD drawing? Mention it here and reply to our confirmation email with the file attached.

Inquiry received — our engineering team will follow up shortly.